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Lot 2.8 | STS CPX (1) ICP Deep Silicon Etch + (1) XEF2 Release Etch Module

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Bidding on this listing starts on Wednesday, September 5, 2018 6:00:00 AM

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Auction Details

Starting Bid   ()
No Reserve   
Auction Ends Thursday, September 6, 2018 2:16:00 PM
Bid History 0 Bids
Auction Starts Wednesday, September 5, 2018 6:00:00 AM
Page Views 115 View Lots

Description

STS CPX (Multiplex) Multi-Chamber Etch System with (1) ICP Deep Silicon Etch + (1) XEF2 Release Etch Module

Serial Number: C050

Date of Manufacture: 1998

CfgWafer Size: 150mm

Max Wafer Size: 200mm (with Process Kit Change)

Configuration -

  • Main Body (110" x 63") with Vacuum Load Locks and Transfer Chamber
  • x1 ICP Deep Silicon Etch Chamber
  • x1 XeF2 (Xenon Difluoride) Polysilicon Release Etch Chamber
  • x1 Roughing Pump
  • x2 Load Locks Pumps
  • x2 Chamber Pumps
  • Thermco Chiller
  • Books MX600 with 2 VCE's
  • STS PRO Software connected via DeviceNet
  • Computer Runs Windows

**The unit is Crated (13 Crates) and Ready to Ship (Located in USA Warehouse)

Additional Information
Location USA