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  Lot # 1

Datacon 2200APM Die Bonder

Located in Rochester, NY

  • Item ID # 5872922
  • End Date
  • Start Date
  • Sold

Datacon 2200APM Die Bonder

Operational Machine decommissioned from working lab.

Tool is configured for 8" wafer frames and can support 6" and 8" wafer stock.

Package loading done using 3.1" x 12" J boats.

Epoxy dispenses using an auger technology.

Questions & Answers
Q: Dear Sir, what is the buyer premium and purchase T&C's for our reference? posted by: Chokdee 7/21/2021 9:36 AM PT
A: Buyer's premium is 18% for all our auctions and terms can be found here:
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