Datacon 2200 EVO Die Bonder Hybrid (2011)

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Back-end Semiconductor Equipment | (Closed #8199538)

Lot # 20

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Datacon 2200 EVO Die Bonder Hybrid (2011)

Located in Central Europe

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Item ID # 8679072
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Description

Datacon 2200 EVO Die Bonder Hybrid, MFD: 2011

Standard wafer table 6 - 12 inch

Ejector With 5 position carousel

7 position toolbank

Flux slider is installed on the machine

Standard type 1 indexer

No wafer magazine lift

Standard time pressure dispenser

Squeegee unit on the machine

Details

Location Switzerland

Questions & Answers

Q: Could send more photo include bonehead, workholder (indexer)...etc. to our email for our review? Thank you. posted by: Chokdee 10/14/2023 12:49 AM PT

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