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Abatement Systems
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Back-End Equipment
12
Coaters/Developers
0
Diffusion
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Electronic Test & Measurement
193
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1
Frontend Semi
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Implant
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31
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85
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2
Spin Rinse Dryers
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Wafer Processing
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Back-end Semiconductor Equipment
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Back-end Semiconductor Equipment
Lab / Scientific / Analytical
General Lab/Scientific
Datacon 2200 APM Die Bonder Hybrid (2005)
(8679113)
Ended
Datacon 2200 APM Die Bonder Hybrid (2005)
Located in Central Europe
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Item ID
# 8679114
End Date
Start Date
Description
Datacon 2200 APM Die Bonder Hybrid, Dual Cab, MFD: 2005
Details
Location
Switzerland
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