FabExchange Auctions - ESEC 2008xP3 Die Bonder (2003)

× Bidding has ended on this item.

Back-end Semiconductor Equipment | (Closed #8199538)

Lot # 29

Ended

ESEC 2008xP3 Die Bonder (2003)

Located in Central Europe

3 Watching Add to Watch List

Listing Image

Item ID # 8679450
End Date
Start Date

Sold

Description

ESEC 2008xP3 Die Bonder Leadframe, MFD: 2003, TOS, FPD, ODC, WMP, 300mm

Location Switzerland

Questions & Answers

There are no questions for this listing.

Page Views 416