FabExchange Auctions - ESEC 3088 Wire Bonder (2003)

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Back-end Semiconductor Equipment | (Closed #8199538)

Lot # 38

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ESEC 3088 Wire Bonder (2003)

Located in Central Europe

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Item ID # 8679828
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Description

ESEC 3088 Wire / Ball Bonder Leadframe, MFD: 2003, Serial# 306274, CU kit Copper Bonder

Location Switzerland

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